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SC995e™ Lead Free Bar Solder Outperforms All Others

Brighter, Shinier Solder Deposits on the Circuit Board


Thinner Solder Deposits with Greater Co-Planarity

Less Copper Diffusion from an Enhanced Inter-Metallic Formation

Metallic Resources’ SC995e (Sn99.5/Cu0.5/Co) electrolytic lead free alloy is specially designed for use in all hot air leveling soldering applications. Hot air leveling solder pots using electrolytic solder provide energy savings, extended pot life, reduced thermal stress, and reduced potential of contamination. Lower viscosity improves the fluidity, which in turn provides faster, more uniform wetting. The electrolytic manufacturing process creates a solder that has a more uniform deposition of solder onto the bare board, while at the same time creating a smoother surface. It assures much greater batch-to-batch consistency for predictable solder performance in the solder pot.

Technical Bulletin Solder Pot Purge Program MSDS Sheets

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head office Metallic Resources, Inc.
2368 East Enterprise Parkway, Twinsburg, OH 44087
Branch Office 1 Metallic Solders de Mexico S. de R.L. de C.V
Norte 7 No. 35-A entre Poniente 4 y Diagonal Lorenzo, de la Garza Cd. Indust. H. Matamoros, Tamps.
Branch Office 2 Metallic Resources (Shenzhen) Co., Ltd
Rongshutang Industrial Park, Longgang District, Shenzhen, China 518116
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